Paper
12 October 2016 Development of three-dimensional memory (3D-M)
Hong-Yu Yu, Chen Shen, Lingli Jiang, Bin Dong, Guobiao Zhang
Author Affiliations +
Proceedings Volume 9818, 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage; 981805 (2016) https://doi.org/10.1117/12.2245145
Event: 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage, 2016, Changzhou, China
Abstract
Since the invention of 3-D ROM in 1996, three-dimensional memory (3D-M) has been under development for nearly two decades. In this presentation, we'll review the 3D-M history and compare different 3D-Ms (including 3D-OTP from Matrix Semiconductor, 3D-NAND from Samsung and 3D-XPoint from Intel/Micron).
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hong-Yu Yu, Chen Shen, Lingli Jiang, Bin Dong, and Guobiao Zhang "Development of three-dimensional memory (3D-M)", Proc. SPIE 9818, 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage, 981805 (12 October 2016); https://doi.org/10.1117/12.2245145
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconductors

Computer architecture

Diodes

Computer programming

Transistors

3D optical data storage

Data storage

RELATED CONTENT

ZnO-based multiple channel and multiple gate FinMOSFETs
Proceedings of SPIE (February 27 2016)
Integration via 3rd dimension: 3D power scaling
Proceedings of SPIE (October 03 2018)
A large scale integration based, signal processor ...
Proceedings of SPIE (July 30 1982)
On-the-fly reconfigurable logic
Proceedings of SPIE (February 28 2005)
An open source synthesisable model in VHDL of a 64...
Proceedings of SPIE (January 11 2007)

Back to Top