A method for quantifying the three-dimensional shape of circuit patterns with a top-down CD-SEM image

Kenji Yasui; Mayuka Osaki; Hitoshi Namai; Yuki Ojima; Masami Ikota; Maki Tanaka

doi:10.1117/12.2614738

13 June 2022 A method for quantifying the three-dimensional shape of circuit patterns with a top-down CD-SEM image

Kenji Yasui, Mayuka Osaki, Hitoshi Namai, Yuki Ojima, Masami Ikota, Maki Tanaka

Proceedings Volume PC12053, Metrology, Inspection, and Process Control XXXVI; PC120530R (2022) https://doi.org/10.1117/12.2614738
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

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Kenji Yasui, Mayuka Osaki, Hitoshi Namai, Yuki Ojima, Masami Ikota, and Maki Tanaka "A method for quantifying the three-dimensional shape of circuit patterns with a top-down CD-SEM image", Proc. SPIE PC12053, Metrology, Inspection, and Process Control XXXVI, PC120530R (13 June 2022); https://doi.org/10.1117/12.2614738

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