Photolithography equipment is the enabler of semiconductor device development. While i-line and DUV equipment replaces Mask Aligners to satisfy the overall miniaturization of More-than-Moore components (Power, RF, MEMS..), Advanced Packaging (AP) elaboration is tormented by multitude of challenges.
Indeed, packaging is the limitation to performance of components manufactured with EUV lithography. Hence, AP architectures are flourishing, for which Laser Direct Imaging as well as i-line and DUV patterning are used.
In this exciting time, we study photolithography equipment market, ecosystem and technology trends looking in detail into the forecast, market share, supply chain and auxiliary to patterning processes and equipment.
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