Plug and play fiber coupling at the wafer-scale is highly relevant to interconnect photonic integrated circuits (PICs), switches and multiplexer for short to long range communication, as well as chiplets in new chip design with optical interconnects. A new solution is presented being compact, low-loss, and in plane, adaptable to a wide range of fibers. It is based on beam-shaping reflecting elements monolithically fabricated with integrated comp like fiber alignment structures. Successful assembly of a 12-fiber ribbon is demonstrated with excess losses as low as 0.35 dB. The processes and methods are highly homogeneous and scalable.
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