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13 March 2024 Reliability assessment of a fully packaged 1x12 silicon photonic MEMS multicast switch
Jae Hyeon Kim, Dong Uk Kim, Mingi Lim, Young J. Park, Dong Ju Choi, Myung Seok Hong, Kyoungsik Yu, Sangyoon Han
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Proceedings Volume PC12899, MOEMS and Miniaturized Systems XXIII; PC1289901 (2024) https://doi.org/10.1117/12.3001263
Event: SPIE OPTO, 2024, San Francisco, California, United States
Abstract
This study conducted extensive reliability and stability tests on a fully packaged 1x12 silicon photonic MEMS switch. The switch underwent optical and electrical packaging, including electrostatic discharge (ESD) protection. Durability tests, such as endurance and hysteresis tests, were performed to assess the switch's stability with billions of cycles. Optomechanical stability was evaluated through long-term measurements of optical output powers in single-cast and multi-cast scenarios. High-speed data transmission tests and eye diagram analysis were conducted to evaluate signal integrity. This research provides valuable insights into the reliability of fully packaged silicon photonic MEMS devices and contributes to the advancement and wider adoption of this technology for commercial applications.
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Jae Hyeon Kim, Dong Uk Kim, Mingi Lim, Young J. Park, Dong Ju Choi, Myung Seok Hong, Kyoungsik Yu, and Sangyoon Han "Reliability assessment of a fully packaged 1x12 silicon photonic MEMS multicast switch", Proc. SPIE PC12899, MOEMS and Miniaturized Systems XXIII, PC1289901 (13 March 2024); https://doi.org/10.1117/12.3001263
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KEYWORDS
Optical switching
Microelectromechanical systems
Silicon photonics
Reliability
Optical communications
Optical networks
Eye
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