1 October 2004 Candidate plasma-facing materials for extreme ultraviolet lithography source components
Ahmed Hassanein, Tatiana A. Burtseva, Jeffrey N. Brooks, Isak K. Konkashbaev, Bryan J. Rice
Author Affiliations +
Abstract
Material selection and lifetime issues for extreme ultraviolet (EUV) lithography are of critical importance to the success of this technology for commercial applications. This work reviews current trends in production and use of plasma-facing electrodes, insulators, and wall materials for EUV-type sources. Ideal candidate materials should be able to: withstand high thermal shock from the short pulsed plasma; withstand high thermal loads without structural failure; reduce debris generation during discharge; and be machined accurately. We reviewed the literature on current and proposed fusion plasma-facing materials as well as current experience with plasma gun and other simulation devices. Both fusion and EUV source materials involve issues of surface erosion by particle sputtering and heat-induced evaporation/melting. These materials are either bare structural materials or surface coatings. EUV materials can be divided into four categories: wall, electrode, optical, and insulator materials. For electric discharge sources, all four types are required, whereas laser-produced plasma EUV sources do not require electrode and insulator materials. Several types of candidate alloy and other materials and methods of manufacture are recommended for each component of EUV lithography light sources.
©(2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Ahmed Hassanein, Tatiana A. Burtseva, Jeffrey N. Brooks, Isak K. Konkashbaev, and Bryan J. Rice "Candidate plasma-facing materials for extreme ultraviolet lithography source components," Journal of Micro/Nanolithography, MEMS, and MOEMS 3(4), (1 October 2004). https://doi.org/10.1117/1.1793153
Published: 1 October 2004
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KEYWORDS
Electrodes

Plasma

Copper

Dielectrics

Extreme ultraviolet

Manufacturing

Resistance

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