Packaging and performance of a high-speed indium phosphide access switch

Rainer K. Baettig; Mark Fitzpatrick; Olivier Anthamatten; Bernd Valk

doi:10.1117/12.205678

1 September 1995 Packaging and performance of a high-speed indium phosphide access switch

Rainer K. Baettig, Mark Fitzpatrick, Olivier Anthamatten, Bernd Valk

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Optical Engineering, Vol. 34, Issue 9, (September 1995). https://doi.org/10.1117/12.205678

Abstract

The assembly of optoelectronic devices in their bare chip form into fully functional modules and the performance of a 1 x 2 optical space switch, combined with a dedicated high-speed digital-driver integrated circuit, is reported. The specifications of the packaged module closely approach the data on the unpackaged devices. The peak digital modulation rate of the switch is 1.5 Gbit/s, a performance compatible with many broadband uses. Successful testing in a system test bed demonstrates the usefulness of the realized module from an application point of view. High-speed optoelectronic assembly technology without performance degradation requires a number of packaging skills. These include rugged submicron-accuracy fiber fixing, suitable microwave electronic interconnections, and appropriate thermal-load management

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Rainer K. Baettig, Mark Fitzpatrick, Olivier Anthamatten, and Bernd Valk "Packaging and performance of a high-speed indium phosphide access switch," Optical Engineering 34(9), (1 September 1995). https://doi.org/10.1117/12.205678

Published: 1 September 1995

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