Inelastic effects in a thermoplastic adhesive used for bonding a diamond disk

Cynthia G. Madras; Peter Y. Wong; Ioannis N. Miaoulis

doi:10.1117/1.600790

1 August 1996 Inelastic effects in a thermoplastic adhesive used for bonding a diamond disk

Cynthia G. Madras, Peter Y. Wong, Ioannis N. Miaoulis

Optical Engineering, Vol. 35, Issue 8, (August 1996). https://doi.org/10.1117/1.600790

A 1-in.-diam polished diamond disk was bonded to a disk of zinc sulfide (ZnS) using a high-temperature thermoplastic adhesive to form an optical structure that may be used for infrared applications. A postbonding thermal-stress-induced deformation in the structure at room temperature was observed to decrease exponentially over time. This curvature decrease may be attributed to viscoelastic stress relaxation within the adhesive layer. The relaxation behavior of the adhesive layer was characterized over a range of temperatures above room temperature by observing curvature changes in the structure heated to these temperatures. This characterization has led to knowledge of the deformational behavior of this structure during manufacturing and service conditions. In addition, relaxation and approximate physical properties of the adhesive were extracted from the observed behavior.

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Cynthia G. Madras, Peter Y. Wong, and Ioannis N. Miaoulis "Inelastic effects in a thermoplastic adhesive used for bonding a diamond disk," Optical Engineering 35(8), (1 August 1996). https://doi.org/10.1117/1.600790

Published: 1 August 1996

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