EUV lithography continues to make scaling cost effective for chip manufacturers and allows Moore`s law to pursue. High NA EUV with its increased numerical aperture (NA) from 0.33NA to 0.55NA enables 1.7x smaller features and improved local CDU. This brings several benefits for advance chipmakers such as patterning cost reduction due to multi-patterning, reduced defect density as a result of process simplification and shorter cycle time via mask reduction. Currently, there are multiple high NA EUV systems (EXE:5000) which completed the built and qualification in the ASML factory. The first performance data is being collected via one of these high NA EUV systems. This paper will cover the performance results of the high NA EUV platform (EXE:5000) on imaging and overlay based on the initial findings from common learning collaboration. Furthermore, the progresses towards future high NA EUV systems will be described.
On-product overlay requirements are becoming more challenging with every next technology node due to the continued decrease of the device dimensions and process tolerances. Therefore, current and future technology nodes require demanding metrology capabilities such as target designs that are robust towards process variations and high overlay measurement density (e.g. for higher order process corrections) to enable advanced process control solutions. The impact of advanced control solutions based on YieldStar overlay data is being presented in this paper. Multi patterning techniques are applied for critical layers and leading to additional overlay measurement demands. The use of 1D process steps results in the need of overlay measurements relative to more than one layer. Dealing with the increased number of overlay measurements while keeping the high measurement density and metrology accuracy at the same time presents a challenge for high volume manufacturing (HVM). These challenges are addressed by the capability to measure multi-layer targets with the recently introduced YieldStar metrology tool, YS350. On-product overlay results of such multi-layers and standard targets are presented including measurement stability performance.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.