The rapid development and adoption of digital technology is leading to an increase in demand for
smaller, faster digital data devices and faster digital telecommunication networks. This trend
requires increased network bandwidth to handle large amounts of data and seamless integration of
network devices with compatible end-user devices. This need is being met by using fiber-optic and
photonics technology, infra-red (IR) signals to transmit information, and is fundamental changing
the communication industry, thereby creating a need for new polymeric materials.
New ULTEM* polyetherimide (PEI) and EXTEM* thermoplastic polyimide (TPI) resins
meet the material requirements for the optoelectronics industry. These resins have building blocks
enabling IR light transmission without degrading signal quality. They can be injection-molded into
thin, precision optical lenses and connectors. ULTEM* resins are been widely used in this industry
as fiber-optic components in trans-receivers. EXTEM* resins are amenable to lead-free soldering
(LFS), a greener industrial assembly process. While still being IR-transparent, EXTEM* resin is an
ideal material for LFS capable substrates, connectors and lenses. An optical product portfolio has
been developed and is being presented as a solution to the opto-electronics component industry and
some of the successful applications therein.
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