We present a strain engineering platform that allows the dynamic tuning of the emission wavelength of a monolayer WSe2. A large and localized strain was induced in monolayer 2D materials by patterning a photoresist layer with internal stress into two elliptical shapes with a finite gap in between, which is referred to as a dimer in this work. By applying laser annealing on the dimer stressor while monitoring the exciton emission, we demonstrate the capability to dynamically tune the emission wavelength of the bright exciton in the monolayer WSe2.
The photonics-based approach has recently become a strong candidate for realising a large-scale, practical quantum processor. Particularly in recent years, two-dimensional (2D) materials have become a strong candidate for developing an ideal integrated light source owing to their several unique advantages such as convenient on-chip integration. In this work, we study the effect of strain on the emission wavelength and carrier lifetime. We first show that the geometry of stressors can adjust the amount of strain and emission wavelength. Using this strain engineering technique, we demonstrate that the emission wavelength can be significantly shifted by ~10 nm while the carrier lifetime can also be engineered by ~30 %.
Combining Sn alloying and tensile strain to Ge has emerged as the most promising engineering approach to create an efficient Si-compatible lasing medium. The residual compressive strain in GeSn has thus far made the simple geometrical strain amplification technique unsuitable for achieving tensile strained GeSn. Herein, by utilizing two unique techniques, we report the introduction of a uniaxial tensile strain directly into GeSn micro/nanostructures. By converting GeSn from indirect to direct bandgap material via tensile strain, we achieve a 10-fold increase in the light emission intensity.
In this work, metal-semiconductor-metal photodetectors (MSM PDs) on a GeSn-on-insulator (GeSnOI) platform were demonstrated. This platform was realized by direct wafer bonding (DWB) and layer transfer methods using 9% Sn composition of GeSn film epitaxial-grown on Si. The compressive strain in the GeSn film was observed as ~0.23%, which indicates a significant reduction of the strain compared to the ~5.5% lattice mismatch at an interface of the Ge0.91Sn0.09/Si. GeSn MSM PDs demonstrated on a GeSnOI platform displayed a low dark current of 4nA at a 1V of bias voltage due to the insertion of a thin aluminum oxide (Al2O3) layer in an interface of metal/GeSn for an alleviation of Fermi-level pinning. The responsivity was 0.5 and 0.29 A/W at the wavelength of 1,600 and 2,033nm at 2V, respectively. This work paves the way for GeSnOI photonics as the next promising platform along with Si-on-insulator (SOI) and Ge-on-insulator (GOI) platforms for mid-infrared (MIR) communication and sensing applications.
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