In this work, we show that a 2D cleave layer (such as epitaxial graphene on SiC) can be used for precise release of GaNbased light emitting diodes (LEDs) from the LED-substrate interface. We demonstrate the thinnest GaN-based blue LED and report on the initial electrical and optical characteristics. Our LED device employs vertical architecture: promising excellent current spreading, improved heat dissipation, and high light extraction with respect to the lateral one. Compared to conventional LED layer release techniques used for forming vertical LEDs (such as laser-liftoff and chemical lift-off techniques), our process distinguishes itself with being wafer-scalable (large area devices are possible) and substrate reuse opportunity.
This work presents a new type of polarization-free GaN emitter. The unique aspect of this work is that the ultraviolet and
visible emission originates from the cubic phase GaN and the cubic phase InGaN/GaN multi-quantum-wells,
respectively. Conventionally, GaN emitters (e.g. light emitting diodes, laser diodes) are wurtzite phase thus strong
polarization fields exist across the structure contributing to the “droop” behavior – a phenomenon defined as “the
reduction in emitter efficiency as injection current increases”. The elimination of piezoelectric fields in GaN-based
emitters as proposed in this work provide the potential for achieving a 100% internal efficiency and might lead to droopfree
light emitting diodes. In addition, this work demonstrates co-integration of GaN emitters on cheap and scalable
CMOS-compatible Si (100) substrate, which yields possibility of realizing a GaN laser diode uniquely – via forming
mirrors along the naturally occurring cubic phase GaN-Si(100) cleavage planes.
Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.
Indium Gallium Nitride (InGaN) based PV have the best fit to the solar spectrum of any alloy system and emerging LED lighting based on InGaN technology and has the potential to reduce energy consumption by nearly one half while enabling significant carbon emission reduction. However, getting the maximum benefit from GaN diode -based PV and LEDs will require wide-scale adoption. A key bottleneck for this is the device cost, which is currently dominated by the substrate (i.e. sapphire) and the epitaxy (i.e. GaN). This work investigates two schemes for reducing such costs. First, we investigated the integration of Zinc Oxide (ZnO) in InGaN-based diodes. (Successful growth of GaN on ZnO template layers (on sapphire) was illustrated. These templates can then be used as sacrificial release layers for chemical lift-off. Such an approach provides an alternative to laser lift-off for the transfer of GaN to substrates with a superior cost-performance profile, plus an added advantage of reclaiming the expensive single-crystal sapphire. It was also illustrated that substitution of low temperature n-type ZnO for n-GaN layers can combat indium leakage from InGaN quantum well active layers in inverted p-n junction structures. The ZnO overlayers can also double as transparent contacts with a nanostructured surface which enhances light in/out coupling. Thus ZnO was confirmed to be an effective GaN substitute which offers added flexibility in device design and can be used in order to simultaneously reduce the epitaxial cost and boost the device performance. Second, we investigated the use of GaN templates on patterned Silicon (100) substrates for reduced substrate cost LED applications. Controlled local metal organic chemical vapor deposition epitaxy of cubic phase GaN with on-axis Si(100) substrates was illustrated. Scanning electron microscopy and transmission electron microscopy techniques were used to investigate uniformity and examine the defect structure in the GaN. Our results suggest that groove structures are very promising for controlled local epitaxy of cubic phase GaN. Overall, it is concluded that there are significant opportunities for cost reduction in novel hybrid diodes based on ZnO-InGaN-Si hybridization.
Gallium Nitride (GaN) is a unique material system that has been heavily exploited for photonic devices thanks to
ultraviolet-to-terahertz spectral tunability. However, without a cost effective approach, GaN technology is limited to
laboratory demonstrations and niche applications. In this investigation, integration of GaN on Silicon (100) substrates is
attempted to enable widespread application of GaN based optoelectronics. Controlled local epitaxy of wurtzite phase
GaN on on-axis Si(100) substrates is demonstrated via metal organic chemical vapor deposition (MOCVD). CMOScompatible
fabrication scheme is used to realize [SiO2-Si{111}-Si{100}] groove structures on conventional 200-mm
Si(100) substrates. MOCVD growth (surface treatment, nucleation, initiation) conditions are studied to achieve
controlled GaN epitaxy on such grooved Si(100) substrates. Scanning electron microscopy and transmission electron
microscopy techniques are used to determine uniformity and defectivity of the GaN. Our results show that
aforementioned groove structures along with optimized MOCVD growth conditions can be used to achieve controlled
local epitaxy of wurtzite phase GaN on on-axis Si(100) substrates.
Resonant tunneling diode (RTD) is an electronic device embodying a unique quantum-interference phenomenon:
negative differential resistance (NDR). Compared to other negative resistance devices such as (Esaki) tunnel and
transferred-electron devices, RTDs operate much faster and at higher temperatures. III-nitride materials, composed of
AlGaInN alloys, have wide bandgap, high carrier mobility and thermal stability; making them ideal for high power high
frequency RTDs. Moreover, larger conduction band discontinuity promise higher NDR than other materials (such as
GaAs) and room-temperature operation. However, earlier efforts on GaN-based RTD structures have failed to achieve a
reliable and reproducible NDR. Recently, we have demonstrated for the first time that minimizing dislocation density
and eliminating the piezoelectric fields enable reliable and reproducible NDR in GaN-based RTDs even at room
temperature. Observation of NDR under both forward and reverse bias as well as at room and low temperatures attribute
the NDR behaviour to quantum tunneling. This demonstration marks an important milestone in exploring III-nitride
quantum devices, and will pave the way towards fundamental quantum transport studies as well as for high frequency
optoelectronic devices such as terahertz emitters based on oscillators and cascading structures.
This review emphasizes controlled shallow doping of GaAs by ion implantation and its limitations to the state-of-art GaAs IC technology. It discusses the electrical activation behavior of implanted silicon in GaAs upon subsequent capless or silicon nitride capped rapid thermal annealing (RTA). It is demonstrated that atomic H diffuses into the implanted region of GaAs during PECVD of a Si3N4 cap and the H retards the electrical activation kinetics of the implanted Si. Applications of ion implantation to achieve buried-p layers as well as isolation between neighboring devices in GaAs are also briefly discussed.
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