Dr. Douglas R. Sparks
at Integrated Sensing Systems Inc
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 23 December 2003 Paper
Douglas Sparks, Sonbol Massoud-Ansari, Nader Najafi
Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.530414
KEYWORDS: Packaging, Wafer bonding, Glasses, Silicon, Microelectromechanical systems, Sensors, Particles, Metals, Semiconducting wafers, Resonators

Proceedings Article | 5 September 1997 Paper
Proceedings Volume 3223, (1997) https://doi.org/10.1117/12.284483
KEYWORDS: Packaging, Integrated circuits, Integrated circuit design, Integrated circuit packaging, Wafer bonding, Plasma etching, Sensors, Microelectromechanical systems, Silicon, Micromachining

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