Linear fiber-optic image slicer is used more and more in spatial exploration and imaging system. In this paper, a plane
arranging method of fiber-optic array based on Si-V grooves is established in order to improve the accuracy and reduce
the cost of manufacturing. Firstly, the Si-V groove array is micro-machined with anisotropic etching process, then optical
fibers are placed in the grooves orderly with plane arranging method. Secondly, the end surfaces of the device are
polished, also the linear fiber-optic image slicer is packaged. Finally, some parameters are tested, including structure
parameters, transmittivity and vibration test. Experimental results indicate that the maximum error accumulated in 2000
periods of the Si-V grooves is 0.5μm, the error of the height in
Si-V grooves is less than 0.15μm, the roughness of the
end surface is less than 0.9nm. The transmittivity of the linear fiber-optic image slicer that without optical film is 51.46%
at the wavelength of 632.8nm. After random vibration experiment, the ratio of the broken fiber increased by 0.1%. While
the temperature reached 320°C, the stress of epoxy will be 130Mpa, which is close to the limit resistance stress of
139Mpa, some cracks appeared.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.