Dr. Gurdaman Khaira Profile

Dr. Gurdaman Khaira

Software Development Engineer at Siemens EDA

SPIE Involvement:

Author

Publications (16)

Proceedings Article | 10 April 2024 Presentation

Presentation

Layout simulation for directed self-assembly with chemo-epitaxy methodology

Shibing Wang, Yixiao Zhang, Jiechang Hou, Yuansheng Ma, Daman Khaira, Germain Fenger, Yuyang Sun, Bassem Hamieh, Boaz Alperson, Durairaj Baskaran, Md Rahman, Jerome Wandell, Youngjun Her

Proceedings Volume 12954, 129540W (2024) https://doi.org/10.1117/12.3010510

KEYWORDS: Directed self assembly, Stochastic processes, Optical lithography, Line edge roughness, Extreme ultraviolet, Atomic layer deposition, Semiconductors, Product engineering, Polymers, Personal protective equipment

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SPIE Journal Paper | 19 October 2023

Applications of large field of view e-beam metrology to contour-based optical proximity correction modeling

Chih-I Wei, Seulki Kang, Sayantan Das, Masahiro Oya, Yosuke Okamoto, Kotaro Maruyama, Germain Fenger, Azat Latypov, Ir Kusnadi, Gurdaman Khaira, Yuichiro Yamazaki, Werner Gillijns, Sandip Halder, Gian Lorusso

JM3, Vol. 22, Issue 04, 041603, (October 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.4.041603

KEYWORDS: Modeling, Data modeling, Semiconducting wafers, Optical proximity correction, Contour modeling, Metrology, Calibration, Stochastic processes, Scanning electron microscopy, Performance modeling

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Proceedings Article | 26 May 2022 Presentation + Paper

Presentation + Paper

Calibration of Gaussian random field stochastic EUV models

Azat Latypov, Chih-I Wei, Peter De Bisschop, Gurdaman Khaira, Germain Fenger

Proceedings Volume 12051, 1205105 (2022) https://doi.org/10.1117/12.2614142

KEYWORDS: Stochastic processes, Line edge roughness, Calibration, Line width roughness, Extreme ultraviolet, Statistical analysis, Diffusion, Photoresist processing, Monte Carlo methods, Extreme ultraviolet lithography

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Proceedings Article | 22 February 2021 Paper

Paper

Fast rigorous modeling of photoresist in lithography

David Fryer, Ignat Moskalenko, Germain Fenger, Daman Khaira, Yunfei Deng, Yuri Granik

Proceedings Volume 11613, 116130H (2021) https://doi.org/10.1117/12.2584771

KEYWORDS: SRAF, 3D modeling, Printing, Data modeling, 3D printing

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Better prediction on patterning failure mode with hotspot aware OPC modeling

Chih-I Wei, Stewart Wu, Yunfei Deng, Gurdaman Khaira, Ir Kusnadi, Germain Fenger, Seulki Kang, Yosuke Okamoto, Kotaro Maruyama, Yuichiro Yamazaki, Sayantan Das, Sandip Halder, Werner Gillijns, Gian Lorusso

Proceedings Volume 11611, 1161112 (2021) https://doi.org/10.1117/12.2583837

KEYWORDS: Optical proximity correction, Electron beam lithography, 3D modeling, Inspection, Calibration, Lithography, Data modeling, Time metrology, Semiconducting wafers, Scanning electron microscopy

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Proceedings Article | 22 February 2021 Presentation + Paper

Presentation + Paper

Gaussian random field EUV stochastic models, their generalizations and lithographically meaningful stochastic metrics

Azat Latypov, Gurdaman Khaira, Germain Fenger, Shuling Wang, Marko Chew, Shumay Shang

Proceedings Volume 11609, 1160917 (2021) https://doi.org/10.1117/12.2583792

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Proceedings Article | 23 March 2020 Presentation + Paper

Presentation + Paper

Resist shrinkage during development: rigorous simulations and first compact model for OPC

Yuri Granik, Daman Khaira

Proceedings Volume 11327, 113270G (2020) https://doi.org/10.1117/12.2552527

KEYWORDS: Optical proximity correction, Finite element methods, Printing, Convolution, Atomic force microscopy, Scanning electron microscopy, Polymers, Data modeling, Photoresist processing, Numerical analysis

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Proceedings Article | 23 March 2020 Presentation + Paper

Presentation + Paper

Probability prediction of EUV process failure due to resist-exposure stochastic: applications of Gaussian random fields excursions and Rice's formula

Azat Latypov, Gurdaman Khaira, Germain Fenger, John Sturtevant, Chih-I Wei, Peter De Bisschop

Proceedings Volume 11323, 113230L (2020) https://doi.org/10.1117/12.2551965

KEYWORDS: Stochastic processes, Extreme ultraviolet lithography, Photons, Photoresist processing, Failure analysis, Extreme ultraviolet, Calibration, Statistical analysis, Data modeling, Semiconducting wafers

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Proceedings Article | 17 October 2019 Presentation

Presentation

Photoresist development as a reaction-diffusion process (Conference Presentation)

Gurdaman Khaira, Yuri Granik

Proceedings Volume 11148, 111480P (2019) https://doi.org/10.1117/12.2538165

KEYWORDS: Photoresist developing, Photoresist materials, Photoresist processing, Lithography, Diffusion, Mathematical modeling, Process modeling, Critical dimension metrology, Finite element methods, 3D modeling

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Proceedings Article | 18 March 2019 Presentation

Presentation

Physical and compact modeling of resist deformation (Conference Presentation)

Gurdaman Khaira, Yuri Granik, Kostas Adam, Germain Fenger

Proceedings Volume 10961, 109610E (2019) https://doi.org/10.1117/12.2515128

KEYWORDS: Photoresist developing, Lithography, Finite element methods, Process modeling, Photoresist processing, Computer simulations, Chemically amplified resists, Optical lithography, Photoresist materials, 3D modeling

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Proceedings Article | 30 March 2017 Presentation + Paper

Presentation + Paper

Design technology co-optimization (DTCO) study on self-aligned-via (SAV) with Lamella DSA for sub-7 nm technology

Yuansheng Ma, Jongwook Kye, Gurdaman Khaira, Le Hong, James Word, Yuyang Sun, Joydeep Mitra, J. Andres Torres, Germain Fenger, Harry Levinson

Proceedings Volume 10148, 101480B (2017) https://doi.org/10.1117/12.2258056

KEYWORDS: Optical lithography, Optical proximity correction, Directed self assembly, Resolution enhancement technologies, Etching, Monte Carlo methods, Photomasks, Manufacturing, Metals, Logic, Visualization, Error analysis, Solids

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Proceedings Article | 21 March 2017 Presentation + Paper

Presentation + Paper

Overview and development of EDA tools for integration of DSA into patterning solutions

J. Andres Torres, Germain Fenger, Daman Khaira, Yuansheng Ma, Yuri Granik, Chris Kapral, Joydeep Mitra, Polina Krasnova, Dehia Ait-Ferhat

Proceedings Volume 10144, 101440E (2017) https://doi.org/10.1117/12.2264178

KEYWORDS: Electronic design automation, Photomasks, Polymers, Optical lithography, Design for manufacturing, Lithography, Epitaxy, Inspection, Directed self assembly, Manufacturing, Systems modeling, Visualization, Data modeling

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Directed Self-Assembly is the method by which a self-assembly polymer is forced to follow a desired geometry defined or influenced by a guiding pattern. Such guiding pattern uses surface potentials, confinement or both to achieve polymer configurations that result in circuit-relevant topologies, which can be patterned onto a substrate.

Chemo, and grapho epitaxy of lines and space structures are now routinely inspected at full wafer level to understand the defectivity limits of the materials and their maximum resolution. In the same manner, there is a deeper understanding about the formation of cylinders using grapho-epitaxy processes. Academia has also contributed by developing methods that help reduce the number of masks in advanced nodes by “combining” DSA-compatible groups, thus reducing the total cost of the process.

From the point of view of EDA, new tools are required when a technology is adopted, and most technologies are adopted when they show a clear cost-benefit over alternative techniques. In addition, years of EDA development have led to the creation of very flexible toolkits that permit rapid prototyping and evaluation of new process alternatives. With the development of high-chi materials, and by moving away of the well characterized PS-PMMA systems, as well as novel integrations in the substrates that work in tandem with diblock copolymer systems, it is necessary to assess any new requirements that may or may not need custom tools to support such processes.

Hybrid DSA processes (which contain both chemo and grapho elements), are currently being investigated as possible contenders for sub-5nm process techniques. Because such processes permit the re-distribution of discontinuities in the regular arrays between the substrate and a cut operation, they have the potential to extend the number of applications for DSA.

This paper illustrates the reason as to why some DSA processes can be supported by existing rules and technology, while other processes require the development of highly customized correction tools and models. It also illustrates how developing DSA cannot be done in isolation, and it requires the full collaboration of EDA, Material’s suppliers, Manufacturing equipment, Metrology, and electronic manufacturers.

SPIE Journal Paper | 29 September 2016

Directed self-assembly compliant flow with immersion lithography: from material to design and patterning

Yuansheng Ma, Yan Wang, James Word, Junjiang Lei, Joydeep Mitra, Juan Andres Torres, Le Hong, Germain Fenger, Daman Khaira, Moshe Preil, Jongwook Kye, Harry Levinson

JM3, Vol. 15, Issue 03, 031610, (September 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.3.031610

KEYWORDS: Directed self assembly, Lens design, Optical lithography, Immersion lithography, Photomasks, Neck, Lithography, Critical dimension metrology, Visualization, Optical proximity correction

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Proceedings Article | 22 March 2016 Paper

Paper

Directed Self Assembly (DSA) compliant flow with immersion lithography: from material to design and patterning

Yuansheng Ma, Yan Wang, James Word, Junjiang Lei, Joydeep Mitra, J. Andres Torres, Le Hong, Germain Fenger, Daman Khaira, Moshe Preil, Lei Yuan, Jongwook Kye, Harry Levinson

Proceedings Volume 9777, 97770N (2016) https://doi.org/10.1117/12.2219505

KEYWORDS: Optical lithography, Semiconducting wafers, Lithography, Directed self assembly, Immersion lithography, Extreme ultraviolet, Optical resolution, Neck, Modulation, Photomasks, Lens design, Ions, Neodymium, Visualization, Code division multiplexing

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Proceedings Article | 28 March 2014 Paper

Paper

Physical verification and manufacturing of contact/via layers using grapho-epitaxy DSA processes

J. Andres Torres, Kyohei Sakajiri, David Fryer, Yuri Granik, Yuansheng Ma, Polina Krasnova, Germain Fenger, Seiji Nagahara, Shinichiro Kawakami, Benjamen Rathsack, Gurdaman Khaira, Juan de Pablo, Julien Ryckaert

Proceedings Volume 9053, 90530R (2014) https://doi.org/10.1117/12.2045328

KEYWORDS: Monte Carlo methods, Manufacturing, Lithography, Metals, Photomasks, Optical lithography, Directed self assembly, Visualization, Polymers, Design for manufacturability

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Proceedings Article | 21 March 2012 Paper

Paper

Scalable simulations for directed self-assembly patterning with the use of GPU parallel computing

Kenji Yoshimoto, Brandon Peters, Gurdaman Khaira, Juan de Pablo

Proceedings Volume 8323, 83232P (2012) https://doi.org/10.1117/12.917830

KEYWORDS: Monte Carlo methods, Computer simulations, Parallel computing, Optical lithography, Computing systems, 3D modeling, Polymers, Lithography, Annealing, Directed self assembly

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Showing 5 of 16 publications

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