Dr. Hermann Oppermann Profile

Dr. Hermann Oppermann

Group Manager Intercon Metallurgy/Processes at Fraunhofer-IZM

SPIE Involvement:

Author

Proceedings Article | 28 April 2017 Presentation

Quantum cascade detector at 4.3um wavelength in pixel array configuration (Conference Presentation)

Andreas Harrer, Benedikt Schwarz, Simone Schuler, Peter Reininger, Alexander Wirthmüller, Hermann Detz, Donald MacFarland, Tobias Zederbauer, Aaron Andrews, Mario Rothermund, Hermann Oppermann, Werner Schrenk, Gottfried Strasser

Proceedings Volume 10111, 101112C (2017) https://doi.org/10.1117/12.2252275

KEYWORDS: Infrared sensors, Remote sensing, Image resolution, Photovoltaics, Sensors, Mid-IR, Infrared imaging, Semiconductors, Resistance, Quantum efficiency

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Proceedings Article | 15 March 2016 Paper

Electro-optical circuit board with single-mode glass waveguide optical interconnects

Lars Brusberg, Marcel Neitz, Dominik Pernthaler, Daniel Weber, Bogdan Sirbu, Christian Herbst, Christopher Frey, Marco Queisser, Markus Wöhrmann, Dionysios Manessis, Beatrice Schild, Hermann Oppermann, Yann Eichhammer, Henning Schröder, Andreas Håkansson, Tolga Tekin

Proceedings Volume 9753, 97530J (2016) https://doi.org/10.1117/12.2208103

KEYWORDS: Glasses, Waveguides, Electro optics, Integrated optics, Silicon photonics, Mirrors, Optical interconnects, Silicon, Copper, Vertical cavity surface emitting lasers

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Proceedings Article | 2 February 2012 Paper

Assembly and interconnect formation in MEMS/MOEMS application

Hermann Oppermann

Proceedings Volume 8250, 825002 (2012) https://doi.org/10.1117/12.912820

KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Wafer bonding, Gold, Liquids, Silver, Silicon, Copper, Interfaces, Microopto electromechanical systems

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Proceedings Article | 12 February 2009 Paper

A VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components

Armand Pruijmboom, Silvia Booij, Marcel Schemmann, Klaus Werner, Pieter Hoeven, Henri van Limpt, Steffan Intemann, Rafael Jordan, Thomas Fritzsch, Hermann Oppermann, Michel Barge

Proceedings Volume 7221, 72210S (2009) https://doi.org/10.1117/12.808810

KEYWORDS: Sensors, Vertical cavity surface emitting lasers, Semiconducting wafers, Gallium arsenide, Wafer-level optics, Laser scattering, Lens design, Silicon, Interferometers, Integrated optics

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Proceedings Article | 26 September 2007 Paper

Converter film technology for homogeneous white light

Rafael Jordan, Jörg Bauer, Hermann Oppermann

Proceedings Volume 6797, 67970L (2007) https://doi.org/10.1117/12.759437

KEYWORDS: Light emitting diodes, Light sources, Silicon, Light, Polymers, Transmittance, RGB color model, Particles, Epoxies, Eye

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Proceedings Article | 21 April 2006 Paper

Optimized heat transfer and homogeneous color converting for ultra high brightness LED package

Rafael Jordan, Jörg Bauer, Hermann Oppermann

Proceedings Volume 6198, 61980B (2006) https://doi.org/10.1117/12.662976

KEYWORDS: Light emitting diodes, Silicon carbide, Silicon, Metals, Sapphire, Light sources, Epoxies, Aluminum nitride, Polymers, Light

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Proceedings Article | 22 January 2005 Paper

Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

Hermann Oppermann, Matthias Hutter, Gunter Engelmann, Herbert Reichl

Proceedings Volume 5716, (2005) https://doi.org/10.1117/12.600798

KEYWORDS: Optical alignment, Gold, Silicon, Scanning electron microscopy, Semiconductor lasers, Infrared imaging, Electroplating, Directed self assembly, Photonic integrated circuits, Nickel

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Proceedings Article | 8 September 2004 Paper

Flip-chip assembly and reliability using gold/tin solder bumps

Hermann Oppermann, Matthias Hutter, Matthias Klein, Herbert Reichl

Proceedings Volume 5454, (2004) https://doi.org/10.1117/12.546463

KEYWORDS: Gold, Silicon, Gallium arsenide, Reliability, Tin, Failure analysis, Scanning electron microscopy, Interfaces, Plating, Manufacturing

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Proceedings Article | 10 April 2000 Paper

Advanced flip chip technologies in rf, microwave, and MEMS applications

Hermann Oppermann, C. Kallmayer, M. Klein, R. Aschenbrenner, Herbert Reichl

Proceedings Volume 4019, (2000) https://doi.org/10.1117/12.382326

KEYWORDS: Gold, Adhesives, Sensors, Tin, Semiconducting wafers, Independent component analysis, Reliability, Nickel, Printing, Platinum

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Proceedings Article | 8 September 1998 Paper

Solder-bonded micromachined capacitive pressure sensors

Berthold Rogge, David Moser, Hermann Oppermann, Oliver Paul, Henry Baltes

Proceedings Volume 3514, (1998) https://doi.org/10.1117/12.323902

KEYWORDS: Sensors, Semiconducting wafers, Capacitance, Silicon, Prototyping, Electrodes, CMOS sensors, Plating, Photoresist materials, Environmental sensing

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Showing 5 of 10 publications

Conference Committee Involvement (1)

Manufacturing LEDs for Lighting and Displays

10 September 2007 | Berlin, Germany

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