The damages of TEA-CO2 laser to HgCdTe imaging sensor are researched experimentally and theoretically. The shadows, cracks and dark line are observed. There is a gap between photosensitive layer and CdZnTe which decreases light transmittance, so that the shadows occur. It shows that the crack damages begin from photosensitive layer. The sensor is irradiated by pulse laser, the absorptivity of photosensitive layer is strong, sharp temperatures fluctuations inside the sensor, leading to stress. With the stress increased, the cracks are observed on the surface of the detector. Cracked the surface of the substrate, and effective transmission reduced, which caused gray pixel response decline. The dark line in image occurs several times because Hg atoms separate out from the detector and gather together at the Si-COMS which makes a short circuit between silicon substrate and signal choice line. The volatility of Hg makes the short circuit is unstable, resulting in the dark line repeated in the output image, but the short circuit occurs by chance.
The 248 nm excimer laser etching characteristic of alumina ceramic and sapphire had been studied using different laser fluence and different number of pulses. And the interaction mechanism of 248 nm excimer laser with alumina ceramic and sapphire had been analyzed. The results showed that when the laser fluence was less than 8 J/cm2, the etching depth of alumina ceramic and sapphire were increased with the increase of laser fluence and number of pulses. At the high number pulses and high-energy, the surface of the sapphire had no obvious melting phenomenon, and the alumina ceramic appeared obvious melting phenomenon. The interaction mechanism of excimer laser with alumina ceramics and sapphire was mainly two-photon absorption. But because of the existence of impurities and defects, the coupling between the laser radiation and ceramic and sapphire was strong, and the thermal evaporation mechanism was also obvious.
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