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Junwei Tian
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Publications (1)
Proceedings Article | 5 June 2024 Paper
Simulation analysis of heat dissipation of the inner cavity of closed electronic equipment based on Icepak
Proceedings Volume 13163, 131632S (2024) https://doi.org/10.1117/12.3030644
KEYWORDS: Temperature metrology, Design, Electronic components, Vacuum chambers, Thermal modeling, Instrument modeling, Pipes, 3D modeling, Temperature distribution, Temperature control
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