Mr. Seiya Miura Profile

Seiya Miura

at Canon Inc

SPIE Involvement:

Author

Publications (12)

Proceedings Article | 26 August 2024 Paper

Solutions enabling advanced packaging and heterogeneous integration

Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura

Proceedings Volume 13177, 1317706 (2024) https://doi.org/10.1117/12.3032559

KEYWORDS: Advanced packaging, Packaging, Reticles, Distortion, Optical lithography, Semiconductors

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Proceedings Article | 10 April 2024 Presentation + Paper

Study of patterning for advanced packaging

Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura

Proceedings Volume 12953, 129530W (2024) https://doi.org/10.1117/12.3010657

KEYWORDS: Silicon, Distortion, Glasses, Packaging, Optical lithography, Advanced packaging, Lithography

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Proceedings Article | 10 April 2024 Poster + Paper

A study on detection of wafer process changes using stand-alone wafer metrology tool

Wataru Yamaguchi, Shinichiro Hirai, Kazuya Kijima, Kazuki Ota, Seiya Miura, Isao Tanaka, Kazuhiro Segawa, Charlie Chen

Proceedings Volume 12955, 129552A (2024) https://doi.org/10.1117/12.3009951

KEYWORDS: Semiconducting wafers, Overlay metrology, Inspection, Signal processing, Optical alignment, Distortion, Signal detection, Film thickness, Metrology, Signal intensity

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Proceedings Article | 27 April 2023 Poster + Paper

A study of high-accuracy stand-alone wafer metrology tool for high-productivity of exposure apparatus

Wataru Yamaguchi, Shinichiro Hirai, Ryota Makino, Kazuya Kijima, Seiya Miura, Isao Tanaka, Kazuhiro Segawa, Charlie Chen

Proceedings Volume 12496, 124962B (2023) https://doi.org/10.1117/12.2657243

KEYWORDS: Semiconducting wafers, Deformation, Overlay metrology, Inspection, Metrology, Distortion

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Proceedings Article | 26 May 2022 Poster + Paper

Exposure process optimization using machine learning overlay prediction

Masahiro Yoshida, W. H. Wang, C. H. Huang, Elvis Yang, T. H. Yang, K. C. Chen, Yosuke Takarada, Yoshiki Sakamoto, Shin-ichi Egashira, Ken Otani, Tsukasa Saito, Shoshi Katayama, Seiya Miura, Douglas Shelton

Proceedings Volume 12053, 120531L (2022) https://doi.org/10.1117/12.2611020

KEYWORDS: Data modeling, Semiconducting wafers, Overlay metrology, Machine learning, 3D modeling, Lithography, Data acquisition, Wafer testing, Target detection, Process modeling

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Proceedings Article | 22 February 2021 Presentation + Paper

Lithography tool improvement at productivity and performance with data analysis and machine learning

Yosuke Takarada, Douglas Shelton, Tsuneari Fukada, Shosi Katayama, Ken-Ichiro Mori, Seiya Miura

Proceedings Volume 11613, 1161308 (2021) https://doi.org/10.1117/12.2583784

KEYWORDS: Machine learning, Yield improvement, Semiconductors, Imaging systems, Virtual reality, Overlay metrology, Metrology, Intelligence systems, Detector development, Control systems

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Proceedings Article | 22 February 2021 Presentation + Paper

High-resolution patterning for panel level packaging

Ken-Ichiro Mori, Douglas Shelton, Yoshio Goto, Hiromi Suda, Hiroyuki Wada, Hideo Tanaka, Seiya Miura

Proceedings Volume 11613, 116130C (2021) https://doi.org/10.1117/12.2583689

KEYWORDS: Packaging, Optical lithography, Computing systems, Artificial intelligence, Semiconducting wafers, Projection systems, Photoresist materials, Manufacturing equipment, Manufacturing, Image resolution

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Proceedings Article | 31 March 2014 Paper

The solution to enhance i-line stepper applications by improving mix and match process overlay accuracy

Yuhei Sumiyoshi, Ryo Sasaki, Yasuo Hasegawa, Kentaro Ushiku, Hirotaka Sano, Atsushi Shigenobu, Bunsuke Takeshita, Seiya Miura

Proceedings Volume 9052, 90520H (2014) https://doi.org/10.1117/12.2046769

KEYWORDS: Semiconducting wafers, Distortion, Image processing, Optical alignment, Image sensors, Silicon, Lithography, Overlay metrology, Wafer bonding, Infrared radiation

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Proceedings Article | 12 April 2013 Paper

A study of vertical lithography for high-density 3D structures

Masaki Mizutani, Shin-Ichiro Hirai, Ichiro Koizumi, Ken-Ichiro Mori, Seiya Miura

Proceedings Volume 8683, 86831F (2013) https://doi.org/10.1117/12.2011340

KEYWORDS: Lithography, Semiconducting wafers, Silicon, Photomasks, Optical alignment, Chemically amplified resists, Semiconductors, Optical lithography, Plating, Critical dimension metrology

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Proceedings Article | 13 March 2012 Paper

A study of vertical lithography for high-density 3D structures

Shin-Ichiro Hirai, Nobuyuki Saito, Yoshio Goto, Hiromi Suda, Ken-Ichiro Mori, Seiya Miura

Proceedings Volume 8326, 83261E (2012) https://doi.org/10.1117/12.917877

KEYWORDS: Semiconducting wafers, Plating, Silicon, Distortion, Semiconductors, Optical alignment, Etching, Wafer bonding, Lithography, Electrodes

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Proceedings Article | 26 March 2007 Paper

New projection optics and aberration control system for the 45-nm node

Toshiyuki Yoshihara, Bunsuke Takeshita, Atsushi Shigenobu, Yasuo Hasegawa, Yoshinori Ohsaki, Kazuhiko Mishima, Seiya Miura

Proceedings Volume 6520, 652022 (2007) https://doi.org/10.1117/12.711375

KEYWORDS: Projection systems, Monochromatic aberrations, Wavefront aberrations, Control systems, Sensors, Aberration correction, Optics manufacturing, Metrology, Lithography, Optical properties

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Proceedings Article | 8 August 1993 Paper

Subhalf-micron stepper with a reticle particle monitor

Michio Kohno, Nobuhiro Kodachi, Kazumi Yajima, Seiya Miura

Proceedings Volume 1927, (1993) https://doi.org/10.1117/12.150453

KEYWORDS: Particles, Reticles, Pellicles, Inspection, Semiconducting wafers, Light scattering, Optical lithography, Opacity, Device simulation, Photoresist materials

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Showing 5 of 12 publications

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