Mr. Torsten Vahrenkamp Profile

Torsten Vahrenkamp

CEO at ficonTEC Service GmbH

SPIE Involvement:

Conference Program Committee | Author

Publications (3)

Proceedings Article | 8 April 2019 Paper

Full automatic test environment for high-throughput PIC testing

Colin Dankwart, Moritz Seyfried, Torsten Vahrenkamp

Proceedings Volume 10899, 108990N (2019) https://doi.org/10.1117/12.2511039

KEYWORDS: Photonic integrated circuits, Optical alignment, Optical testing, Waveguides, Motion controllers, Single mode fibers, Semiconducting wafers, Signal to noise ratio, Distance measurement, Packaging

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Proceedings Article | 4 March 2019 Presentation + Paper

Intelligent simultaneous active sub-micron multi-component alignment for next generation datacom applications

Simon Kibben, Moritz Seyfried, Torsten Vahrenkamp

Proceedings Volume 10899, 1089909 (2019) https://doi.org/10.1117/12.2513475

KEYWORDS: Assembly equipment, Optical testing, Optical testing equipment, Optical alignment, Photonic integrated circuits, Optical components, Data communications, Tolerancing, Transceivers

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Proceedings Article | 22 February 2011 Paper

Autoclaveable miniaturized video endoscopes with simplified flip-chip assembly

Erik Beckert, Frank Wippermann, Sarah Walther, Thomas Burkhardt, Bernhard Messerschmidt, Thomas Bartnitzek, Torsten Vahrenkamp, Ramona Eberhardt, Daniel Gäbler, Andreas Tünnermann

Proceedings Volume 7893, 78930B (2011) https://doi.org/10.1117/12.873074

KEYWORDS: Imaging systems, Optics manufacturing, Polymers, Objectives, Spherical lenses, Ceramics, GRIN lenses, Modulation transfer functions, Video, Endoscopes

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Conference Committee Involvement (10)

Components and Packaging for Laser Systems X

29 January 2024 | San Francisco, California, United States

Components and Packaging for Laser Systems IX

30 January 2023 | San Francisco, California, United States

Components and Packaging for Laser Systems VIII

24 January 2022 | San Francisco, California, United States

Components and Packaging for Laser Systems VII

6 March 2021 | Online Only, California, United States

Components and Packaging for Laser Systems VI

3 February 2020 | San Francisco, California, United States

Showing 5 of 10 Conference Committees

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