Mr. Tsuneo Kanda Profile

Tsuneo Kanda

Senior Engineer at Canon Inc

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Author

Publications (5)

Proceedings Article | 7 March 2008 Paper

Performance of the FPA-7000AS7 1.35 NA immersion exposure system for 45-nm mass production

Keiji Yoshimura, Hitoshi Nakano, Hideo Hata, Nobuyoshi Deguchi, Masamichi Kobayashi, Takeaki Ebihara, Yoshio Kawanobe, Tsuneo Kanda

Proceedings Volume 6924, 69241O (2008) https://doi.org/10.1117/12.771876

KEYWORDS: Semiconducting wafers, Particles, Distortion, Liquids, Inspection, Bridges, Polarization, Thin film coatings, Scanning probe microscopy, Overlay metrology

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Proceedings Article | 26 June 2003 Paper

New lens barrel structure utilized on the FPA-6000AS4 and its contribution to the lens performance

Yuji Sudoh, Tsuneo Kanda

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485480

KEYWORDS: Projection systems, Surface plasmons, Lens design, Optics manufacturing, Manufacturing, Optical components, Temperature metrology, Optical design, Photomasks, Wavefront aberrations

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Proceedings Article | 26 June 2003 Paper

0.85-NA ArF exposure system and performance

Tsuneo Kanda, Yoshihiro Shiode, Ken-ichiro Shinoda

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485464

KEYWORDS: Wavefronts, Metrology, Lithography, Lithographic illumination, Photomasks, Optical lithography, Monochromatic aberrations, Semiconducting wafers, Scanning electron microscopy, Silicon

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Proceedings Article | 14 September 2001 Paper

New-generation projection optics for microlithography

Tsuneo Kanda, Takashi Kato

Proceedings Volume 4346, (2001) https://doi.org/10.1117/12.435707

KEYWORDS: Diffusion, Wavefronts, Nanoimprint lithography, Optical lithography, Distortion, Semiconductors, Projection systems, Scanners, Image processing, Optical imaging

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Proceedings Article | 7 July 1997 Paper

Alignment sensor corrections for tool-induced shift (TIS)

Tsuneo Kanda, Kazuhiko Mishima, Eiichi Murakami, Hideki Ina

Proceedings Volume 3051, (1997) https://doi.org/10.1117/12.276005

KEYWORDS: Optical alignment, Sensors, Sensor calibration, Overlay metrology, Semiconductors, Semiconductor manufacturing, Semiconducting wafers

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