Dr. Tymon Barwicz Profile

Dr. Tymon Barwicz

Principle Scientist at Acacia Communications Inc

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Author

Publications (12)

Proceedings Article | 17 May 2019 Presentation + Paper

Monolithically integrated silicon photonic chip sensor for near-infrared trace-gas spectroscopy

Eric Zhang, Yves Martin, Jason Orcutt, Chi Xiong, Martin Glodde, Nathan Marchack, Elizabeth Duch, Tymon Barwicz, Laurent Schares, William M. Green

Proceedings Volume 11010, 110100B (2019) https://doi.org/10.1117/12.2519206

KEYWORDS: Sensors, Waveguides, Photonic integrated circuits, Spectroscopy, Silicon, Semiconductor lasers, Silicon photonics, Integrated photonics, Sensor networks, Fabry–Perot interferometers

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Proceedings Article | 4 March 2019 Paper

Silicon photonic integrated circuit for on-chip spectroscopic gas sensing

Chi Xiong, Yves Martin, Eric Zhang, Jason Orcutt, Martin Glodde, Laurent Schares, Tymon Barwicz, Chu Teng, Gerard Wysocki, William M. Green

Proceedings Volume 10923, 109230G (2019) https://doi.org/10.1117/12.2511793

KEYWORDS: Waveguides, Sensors, Methane, Silicon photonics, Silicon, Spectroscopy, Absorption, Photodetectors, Tunable lasers

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Proceedings Article | 4 March 2019 Paper

Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities

Alexander Janta-Polczynski, Elaine Cyr, Richard Langlois, Paul Fortier, Yoichi Taira, Nicolas Boyer, Tymon Barwicz

Proceedings Volume 10924, 109240X (2019) https://doi.org/10.1117/12.2514966

KEYWORDS: Design for manufacturing, Photonics, Microelectronics, Packaging, Adhesives, Optical alignment, Single mode fibers, Connectors, Electronics, Reliability

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Single-mode integrated photonics assembly is challenging due to the tight alignment required for optical connections. To address this, we have developed a parallelized fiber assembly process using self-alignment of fiber arrays in V-grooves defined on the photonic chip. This approach is compatible with standard automated high-throughput pick and place tools, thus improving the scalability and cost-efficiency of photonic packaging. We describe our efforts toward increasing the assembly throughput as well as making the photonic connections compatible with high temperatures from downstream microelectronic assembly processes, such as lead-free solder reflows. The ability to survive these higher temperatures allows the pretesting of optical engines and paves the way for true co-integration of photonics and electronics. We have shown that attaching fibers to chips using multiple adhesives with partitioning of their function provides substantial gains in both throughput and reliability at a relatively small cost of dispense complexity. The fibers are tacked in place with lengthy adhesive cures performed in a batch process outside of the placement tool so as not to impact the placement tool’s throughput. This approach allows for strong long term structural integrity along with optimized optical index matching between the fiber and the waveguide coupler of the photonic dies. Not only did we observe the same peak optical performance that we previously reported, but we have also demonstrated no experimentally significant optical penalty after 5x lead-free solder reflows, in operational temperature between -15°C and 150°C and, after aggressive microelectronic environmental stressing going beyond the parameters traditionally used in optics. The ability to embed single mode optics in the first level package is a disruptive capability contributing to enable the high-density interconnects needed to meet the ever-increasing bandwidth demands for data communication. We discuss the benefits of such configurations, as well as the challenges for thermal management and system yields.

Proceedings Article | 16 May 2018 Presentation + Paper

Localization and quantification of trace-gas fugitive emissions using a portable optical spectrometer

Eric Zhang, Chu Teng, Theodore van Kessel, Levente Klein, Ramachandran Muralidhar, Chi Xiong, Yves Martin, Jason Orcutt, Marwan Khater, Laurent Schares, Tymon Barwicz, Nathan Marchack, Swetha Kamlapurkar, Sebastian Engelmann, Gerard Wysocki, Norma Sosa, William M. Green

Proceedings Volume 10629, 106290Y (2018) https://doi.org/10.1117/12.2305174

KEYWORDS: Sensors, Spectroscopy, Methane, Optical sensors, Photodetectors, Absorption spectroscopy, Absorption, Calibration, Absorbance

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Proceedings Article | 23 February 2018 Presentation + Paper

Breaking the mold of photonic packaging

Tymon Barwicz, Ted Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer

Proceedings Volume 10535, 105350R (2018) https://doi.org/10.1117/12.2290230

KEYWORDS: Packaging, Silicon photonics, Polymers, Waveguides, Interfaces, Optical alignment

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Proceedings Article | 22 February 2018 Paper

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

Alexander Janta-Polczynski, Elaine Cyr, Jerome Bougie, Alain Drouin, Richard Langlois, Darrell Childers, Shotaro Takenobu, Yoichi Taira, Ted Lichoulas, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Tymon Barwicz

Proceedings Volume 10538, 105380B (2018) https://doi.org/10.1117/12.2291902

KEYWORDS: Photonics, Packaging, Polymers, Microelectronics, Integrated optics, Waveguides, Connectors, Polymer multimode waveguides, Singular optics, Silicon photonics

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Proceedings Article | 21 March 2017 Paper

Silicon photonics and challenges for fabrication

N. Feilchenfeld, K. Nummy, T. Barwicz, D. Gill, E. Kiewra, R. Leidy, J. Orcutt, J. Rosenberg, A. Stricker, C. Whiting, J. Ayala, B. Cucci, D. Dang, T. Doan, M. Ghosal, M. Khater, K. McLean, B. Porth, Z. Sowinski, C. Willets, C. Xiong, C. Yu, S. Yum, K. Giewont, W. M. Green

Proceedings Volume 10149, 101490D (2017) https://doi.org/10.1117/12.2263472

KEYWORDS: Waveguides, Silicon, Germanium, Silicon photonics, Manufacturing, Photonic devices, Sensors, Fiber couplers, Scanning electron microscopy, Structured optical fibers

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Proceedings Article | 21 March 2017 Presentation + Paper

Reducing Line Edge Roughness in Si and SiN through plasma etch chemistry optimization for photonic waveguide applications

Nathan Marchack, Marwan Khater, Jason Orcutt, Josephine Chang, Steven Holmes, Tymon Barwicz, Swetha Kamlapurkar, William Green, Sebastian Engelmann

Proceedings Volume 10149, 101490F (2017) https://doi.org/10.1117/12.2258112

KEYWORDS: Line edge roughness, Silicon, Reactive ion etching, Waveguides, Sensor technology, Optical lithography, Silicon photonics, Waveguide sensors, Sensors, Integrated circuits, Plasma, Etching, Line width roughness, Photomasks, Plasma etching, Lithography

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Proceedings Article | 13 February 2008 Paper

Strategies for successful realization of strong confinement microphotonic devices

Tymon Barwicz, Milos Popovic, Michael Watts, Peter Rakich, Charles Holzwarth, Franz Kaertner, Erich Ippen, Henry Smith

Proceedings Volume 6898, 68980N (2008) https://doi.org/10.1117/12.765986

KEYWORDS: Polarization, Microrings, Optical filters, Waveguides, Calibration, Lithography, Resonators, Semiconducting wafers, Control systems, Silicon

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Proceedings Article | 7 February 2008 Paper

Reconfigurable silicon photonic circuits for telecommunication applications

Tymon Barwicz, Miloš Popovic, Fuwan Gan, Marcus Dahlem, Charles Holzwarth, Peter Rakich, Erich Ippen, Franz Kärtner, Henry Smith

Proceedings Volume 6872, 68720Z (2008) https://doi.org/10.1117/12.772740

KEYWORDS: Waveguides, Silicon, Microrings, Metals, Resonators, Switching, Tunable filters, Reactive ion etching, Optical filters, Silica

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Proceedings Article | 14 February 2007 Paper

Integrated optical components in silicon for high speed analog-to-digital conversion

S. Spector, T. Lyszczarz, M. Geis, D. Lennon, J. Yoon, M. Grein, R. Schulein, R. Amatya, J. Birge, J. Chen, H. Byun, F. Gan, C. Holzwarth, J. Hoyt, E. Ippen, F. Kärtner, A. Khilo, O. Olubuyide, J. Orcutt, M. Park, M. Perrott, M. Popović, T. Barwicz, M. Dahlem, R. Ram, H. Smith

Proceedings Volume 6477, 64770O (2007) https://doi.org/10.1117/12.705219

KEYWORDS: Silicon, Optical filters, Diodes, Modulators, Waveguides, Electronics, Modulation, Femtosecond phenomena, Resonators, Photodiodes

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Proceedings Article | 1 March 2006 Paper

Electronic photonic integrated circuits for high speed, high resolution, analog to digital conversion

F. Kärtner, S. Akiyama, G. Barbastathis, T. Barwicz, H. Byun, D. Danielson, F. Gan, F. Grawert, C. Holzwarth, J. Hoyt, E. Ippen, M. Kim, L. Kimerling, J. Liu, J. Michel, O. Olubuyide, J. Orcutt, M. Park, M. Perrott, M. Popovic, P. Rackich, R. Ram, H. Smith, M. Watts

Proceedings Volume 6125, 612503 (2006) https://doi.org/10.1117/12.655762

KEYWORDS: Germanium, Silicon, Modulators, Modulation, Waveguides, Microrings, Analog electronics, Mode locking, Resonators, Diodes

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Showing 5 of 12 publications

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