Lasers, Fiber Optics, and Communications

Laser three-dimensional printing microchannel heat sink for high-power diode laser array

[+] Author Affiliations
Guannan Jia, Yuntao Qiu, Anru Yan, Shun Yao, Zhiyong Wang

Beijing University of Technology, Institute of Laser Engineering, Pingleyuan No. 100, Beijing 100124, China

Opt. Eng. 55(9), 096105 (Sep 08, 2016). doi:10.1117/1.OE.55.9.096105
History: Received May 13, 2016; Accepted August 22, 2016
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Abstract.  To improve the heat management of high-power diode lasers, a microchannel heat sink is obtained, whose structure is optimized in method of numerical simulation. Following such a design, the microchannel heat sink is fabricated by nickel-based doping rare earth materials by laser three-dimensional (3-D) printing procedure. Since the noncorrosion property of such material has been preliminarily demonstrated by salt spray test, there is no necessity to plate the interior of the laser 3-D printing microchannel heat sink with gold. The coefficient of thermal expansion of such material is 11  ppm/K. The diode laser array (LDA) with 80-W cw output power, 2-mm cavity length, 100-μm emitter width, and 20% fill-factors is mounted on it for the thermal resistance test, and the result is 0.40  K/W. Moreover, the smile effect of the mounted LDA is merely 0.8  μm.

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© 2016 Society of Photo-Optical Instrumentation Engineers

Citation

Guannan Jia ; Yuntao Qiu ; Anru Yan ; Shun Yao and Zhiyong Wang
"Laser three-dimensional printing microchannel heat sink for high-power diode laser array", Opt. Eng. 55(9), 096105 (Sep 08, 2016). ; http://dx.doi.org/10.1117/1.OE.55.9.096105


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