CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 10146 > Article
Presentation
25 May 2017 Advanced hole patterning technology using soft spacer materials (Conference Presentation)
Jong Keun Park, Phillip D. Hustad, Emad Aqad, David Valeri, Mike D. Wagner, Mingqi Li
Author Affiliations +
Proceedings Volume 10146, Advances in Patterning Materials and Processes XXXIV; 101461C (2017) https://doi.org/10.1117/12.2258667
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States
Abstract
A continuing goal in integrated circuit industry is to increase density of features within patterned masks. One pathway being used by the device manufacturers for patterning beyond the ~80nm pitch limitation of 193 immersion lithography is the self-aligned spacer double patterning (SADP). Two orthogonal line space patterns with subsequent SADP can be used for contact holes multiplication. However, a combination of two immersion exposures, two spacer deposition processes, and two etch processes to reach the desired dimensions makes this process expensive and complicated. One alternative technique for contact hole multiplication is the use of an array of pillar patterns. Pillars, imaged with 193 immersion photolithography, can be uniformly deposited with spacer materials until a hole is formed in the center of 4 pillars. Selective removal of the pillar core gives a reversal of phases, a contact hole where there was once a pillar. However, the highly conformal nature of conventional spacer materials causes a problem with this application. The new holes, formed between 4 pillars, by this method have a tendency to be imperfect and not circular. To improve the contact hole circularity, this paper presents the use of both conventional spacer material and soft spacer materials. Application of soft spacer materials can be achieved by an existing coating track without additional cost burden to the device manufacturers.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Jong Keun Park, Phillip D. Hustad, Emad Aqad, David Valeri, Mike D. Wagner, and Mingqi Li "Advanced hole patterning technology using soft spacer materials (Conference Presentation)", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101461C (25 May 2017); https://doi.org/10.1117/12.2258667
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 PRESENTATION
WATCH
PRESENTATION SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
KEYWORDS
Optical lithography
Manufacturing
Coating
Deposition processes
Double patterning technology
Etching
Immersion lithography
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top