Comparing the mechanical stability of the pellicle under mask stage acceleration with different defect conditions

Ji-Hyun Jeon; Ji-Won Kang; Hye-Keun Oh

doi:10.1117/12.2687920

21 November 2023 Comparing the mechanical stability of the pellicle under mask stage acceleration with different defect conditions

Ji-Hyun Jeon, Ji-Won Kang, Hye-Keun Oh

Author Affiliations +

Proceedings Volume 12750, International Conference on Extreme Ultraviolet Lithography 2023; 1275013 (2023) https://doi.org/10.1117/12.2687920
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Conference Poster

Abstract

In the scanner, various forces act on the EUV pellicle. Identifying the underlying causes of pellicle destruction is challenging, and the criteria for evaluating the lifetime of the pellicle are ambiguous. Therefore, it is essential to analyze the complex forces that affect the pellicle and investigate how they impact its durability. Particle defects, in particular, can significantly reduce the lifetime of the pellicle, leading to mechanical damage such as deformation or destruction. To investigate these effects, we examined how particle defects impact the pellicle in the scanner environment, classifying them based on the type of defect. We modeled a scenario involving mask stage acceleration and compared the impact of defect conditions on pellicles, considering the increased scanner speed of a high-NA scanner. The results show that the stress around the defect increases rapidly due to the acceleration of the pellicle after being deflected by gravity. The embedded defect shows the highest stress, which has the potential to decrease the lifetime of the pellicle due to repeated acceleration.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

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Ji-Hyun Jeon, Ji-Won Kang, and Hye-Keun Oh "Comparing the mechanical stability of the pellicle under mask stage acceleration with different defect conditions", Proc. SPIE 12750, International Conference on Extreme Ultraviolet Lithography 2023, 1275013 (21 November 2023); https://doi.org/10.1117/12.2687920

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