Design of a modular lifespan test bench for redirected shape memory alloy wires

C. Pirritano; J. Mayer; D. Scholtes; Y. Goergen; T. Gorges; S. Nalbach; S. Seelecke; P. Motzki

doi:10.1117/12.3010525

9 May 2024 Design of a modular lifespan test bench for redirected shape memory alloy wires

C. Pirritano, J. Mayer, D. Scholtes, Y. Goergen, T. Gorges, S. Nalbach, S. Seelecke, P. Motzki

Proceedings Volume 12946, Active and Passive Smart Structures and Integrated Systems XVIII; 129461U (2024) https://doi.org/10.1117/12.3010525
Event: SPIE Smart Structures + Nondestructive Evaluation, 2024, Long Beach, California, United States

Abstract

In times of increasingly complex overall technical systems and the associated component integration, there is a need to downsize existing components. Due to their high energy density, shape memory alloy (SMA) actuators offer the possibility of developing lightweight and compact systems. These actuators are available in a variety of shapes, e.g., wires. A challenge for shape memory alloy wire actuators arises in the design. SMA actuator wires can typically generate a stroke of 2-4%. One possibility to integrate a certain length for the required actuator stroke without additional elements (e.g., levers) is the deflection of the wire. It can be observed, however, that the lifetime of the deflected wires is significantly shorter than in the non-deflected state, despite the same external mechanical stress and actuator stroke. It is also expected that cracks occur at the deflected points where the mechanical stress is high. Therefore, investigations on the influence of the deflections on the lifetime of SMA wires are necessary. In this paper, a test set-up for deflected SMA wires is developed, which is a modular extension of an existing lifetime test rig for SMA actuator wires. The focus of the setup is the ability of parameter variations to determine their influence on lifetime behavior. Potential influencing factors which are investigated are the deflection radius, the actuator elongation, the deflection path, and the wire diameter. The setup is validated in terms of friction and bending stiffness.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

C. Pirritano, J. Mayer, D. Scholtes, Y. Goergen, T. Gorges, S. Nalbach, S. Seelecke, and P. Motzki "Design of a modular lifespan test bench for redirected shape memory alloy wires", Proc. SPIE 12946, Active and Passive Smart Structures and Integrated Systems XVIII, 129461U (9 May 2024); https://doi.org/10.1117/12.3010525

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