Measuring system XY-5i

Kennichi Kodama; Eiji Matsubara

doi:10.1117/12.209194

22 May 1995 Measuring system XY-5i

Kennichi Kodama, Eiji Matsubara

Proceedings Volume 2439, Integrated Circuit Metrology, Inspection, and Process Control IX; (1995) https://doi.org/10.1117/12.209194
Event: SPIE's 1995 Symposium on Microlithography, 1995, Santa Clara, CA, United States

Abstract

The progress of integration in semiconductor (LSI) is remarkable. We expect that the mass-production of 256M DRAM shall start in the next few years. The design rules for this level of integration will require even more accurately in a system to measure a reticle pattern's position. To meet the measurement requirements for future IC designs, Nikon Corporation has developed to XY-5i. During development, we introduced some new technologies to improve the systems' measurement performance. In this paper, we will explain the new flexure compensation concept and the reduction of measurement error caused by temperature drift. These are the key technologies used to attain the improved performance. This performance will be demonstrated with actual measurement data from the XY-5i.

Citation Download Citation

Kennichi Kodama and Eiji Matsubara "Measuring system XY-5i", Proc. SPIE 2439, Integrated Circuit Metrology, Inspection, and Process Control IX, (22 May 1995); https://doi.org/10.1117/12.209194

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