CONFERENCE PROCEEDINGS
Advanced Search
Cheng-Yu Tsai
at National Changhua Univ of Education
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 19 December 2017 Paper
Feature extraction of the wafer probe marks in IC packaging
Cheng-Yu Tsai, Chia-Te Lin, Chen-Ting Kao, Chau-Shing Wang
Proceedings Volume 10613, 1061308 (2017) https://doi.org/10.1117/12.2299924
KEYWORDS: Image processing, Inspection, Semiconducting wafers, Packaging, Feature extraction, Image enhancement, Image analysis, Digital image processing, Integrated circuits, Image quality
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top