• Optical subsystem/system design and evaluation,
• Opto-electronics packaging: wire bonding, flip-chip bonding, die-bonding, etc,
• Photonics packaging: lensed fiber coupling to PIC,
• High-speed optical transceiver design based on Silicon photonics integrated circuits(Si-PIC) and electronics ICs of TIA and driver ICs packaged on a single PCB,
• RF microwave loss analysis in transmission lines on PCB and PIC,
• RF loss analysis on-chip transmission lines and Mach-Zehnder modulator,
• Thermal management for opto-electronic packaging of COB, flip-chip, and interposer structures, PCB as a heat sink,
• High-speed PCB design over 25Gbps with microstrip and CPW lines,
• Test and evaluation of the PICs, optic modules, and systems with RF and optical connections,
• LiDAR system design and evaluation,
• Design, packaging, and evaluation of Active optical cable(AOC) and optical transceiver (SFP, QSFP) over 100Gbps data rate applying silicon photonics integrated circuits,
• Opto-electronics packaging: wire bonding, flip-chip bonding, die-bonding, etc,
• Photonics packaging: lensed fiber coupling to PIC,
• High-speed optical transceiver design based on Silicon photonics integrated circuits(Si-PIC) and electronics ICs of TIA and driver ICs packaged on a single PCB,
• RF microwave loss analysis in transmission lines on PCB and PIC,
• RF loss analysis on-chip transmission lines and Mach-Zehnder modulator,
• Thermal management for opto-electronic packaging of COB, flip-chip, and interposer structures, PCB as a heat sink,
• High-speed PCB design over 25Gbps with microstrip and CPW lines,
• Test and evaluation of the PICs, optic modules, and systems with RF and optical connections,
• LiDAR system design and evaluation,
• Design, packaging, and evaluation of Active optical cable(AOC) and optical transceiver (SFP, QSFP) over 100Gbps data rate applying silicon photonics integrated circuits,
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