Results for the self-assembly of lamellar silicon-containing high-χ block copolymers (BCP) with innovative neutral top-coat design are presented. We demonstrate that these materials and associated processes are compatible with a standard lithographic process, and oriented toward a potential high volume manufacturing. We show that this dedicated technology is able to guarantee the stability and planarity of the stack even at elevated self-assembly bake temperatures, and opens new opportunity in the fields of 3D BCPs stacks. Finally, we show interesting results for the etch-transfer of a lamellar BCP in silicon.
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