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Jongmin Park
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Publications (1)
Proceedings Article | 10 April 2024 Presentation + Paper
Unique spectral interferometry solutions for complex high aspect ratio 3D NAND structures
Jaesuk Yoon, Jongmin Park, Minjung Shin, Dongchul Ihm, Oshrat Bismuth, Smadar Ferber, Jacob Ofek, Igor Turovets, Isaac Kim
Proceedings Volume 12955, 129551S (2024) https://doi.org/10.1117/12.3010729
KEYWORDS: Semiconducting wafers, 3D metrology, Silicon, Chemical mechanical planarization, Interferometry, Modeling, Scatterometry, Metrology
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