Ms. Michalina W. Chaja Profile

Michalina W. Chaja

at Berner Fachhochschule Technik und Informatik

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Author

Publications (8)

Proceedings Article | 1 April 2022 Presentation

Multi-pulse and beam forming strategies for high throughput at KW level of ultrashort pulsed lasers

Beat Neuenschwander, Stefan Remund, Markus Gafner, Michalina Chaja

Proceedings Volume PC11989, PC119890E (2022) https://doi.org/10.1117/12.2606171

KEYWORDS: Pulsed laser operation, Standards development, Scanners, Metals, Laser systems engineering, Laser development

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Proceedings Article | 1 April 2022 Presentation

Machining of stainless steel and copper with ps-laser pulses and 180W of average power using DOE and synchronized scanning

Beat Neuenschwander, Michalina Chaja, Andreas Oehler, Markus Gafner

Proceedings Volume PC11988, PC119880B (2022) https://doi.org/10.1117/12.2617054

KEYWORDS: Diffractive optical elements, Copper, Surface roughness, Ultrafast phenomena, Scanners, Objectives, Micromachining, Metals, High power lasers, Beam shaping

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Proceedings Article | 24 March 2021 Presentation + Paper

Ultra-short pulses at high average power in the Laser MicroJet

Michalina Chaja, Gregoire Laporte, Peter Cam, Stefan Remund, Beat Neuenschwander

Proceedings Volume 11673, 1167319 (2021) https://doi.org/10.1117/12.2585550

KEYWORDS: Laser applications, Silicon, Semiconductors, Semiconducting wafers, Radium, Pulsed laser operation, Picosecond phenomena, Optical fibers, Metals, Laser development

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Proceedings Article | 8 March 2021 Presentation

Comparison of ultrashort pulse laser ablation with GHz pulse bursts and MHz pulse bursts of metals, silicon, and dielectric materials

Stefan Remund, Markus Gafner, Michalina Chaja, Aivaras Urniežius, Simas Butkus, Beat Neuenschwander

Proceedings Volume 11673, 116730C (2021) https://doi.org/10.1117/12.2583192

KEYWORDS: Laser ablation, Silicon, Semiconductor lasers, Metals, Ultrafast phenomena, Dielectrics, Laser systems engineering, Picosecond phenomena, Zirconium dioxide, Zirconium

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Proceedings Article | 5 March 2021 Presentation

Machining of [100], [110] and [111] oriented silicon with ultrashort laser pulses in the NIR

Beat Neuenschwander, Stefan Remund, Christoph Wildbolz, Michalina Chaja

Proceedings Volume 11673, 116730N (2021) https://doi.org/10.1117/12.2582661

KEYWORDS: Silicon, Semiconductor lasers, Ultrafast phenomena, Near infrared, Surface roughness, Picosecond phenomena, Femtosecond phenomena

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Proceedings Article | 9 March 2020 Presentation

Ultrafast stamping by combination of synchronized galvanometer scanning with DOE's or SLM (Conference Presentation)

Beat Neuenschwander, Markus Gafner, Stefan Remund, Michalina Chaja

Proceedings Volume 11267, 112670Q (2020) https://doi.org/10.1117/12.2550088

KEYWORDS: Diffractive optical elements, Ultrafast phenomena, Spatial light modulators, Laser scanners, 3D scanning, Micromachining, Laser processing, Beam splitters, Scanners

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Proceedings Article | 2 March 2020 Presentation + Paper

Machining metals and silicon with GHz bursts: Surprising tremendous reduction of the specific removal rate for surface texturing applications

Thomas Hirsiger, Markus Gafner, Stefan Remund, Michalina Chaja, Aivaras Urniezius, Simas Butkus, Beat Neuenschwander

Proceedings Volume 11267, 112670T (2020) https://doi.org/10.1117/12.2543948

KEYWORDS: Copper, Silicon, Picosecond phenomena, Metals, Surface roughness, Photomicroscopy, Scanning electron microscopy, Materials processing, Particles, Surface finishing

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Proceedings Article | 13 March 2019 Presentation

Influence of pulse duration in the pico- and femtosecond regime on the absorptance and specific removal rate (Conference Presentation)

Stefan Remund, Michalina Chaja, Yiming Zhang, Beat Neuenschwander

Proceedings Volume 10905, 1090504 (2019) https://doi.org/10.1117/12.2511294

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Showing 5 of 8 publications

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