Dr. Pascal Miller Profile

Dr. Pascal Miller

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 19 June 2003 Paper

Processing of metals and semiconductors by a femtosecond laser-based microfabrication system

Michel Meunier, Bruno Fisette, Alexis Houle, Andrei Kabashin, Sergey Broude, Pascal Miller

Proceedings Volume 4978, (2003) https://doi.org/10.1117/12.478595

KEYWORDS: Laser ablation, Silicon, Femtosecond phenomena, Laser cutting, Laser processing, Imaging systems, Semiconductor lasers, Semiconducting wafers, Microfabrication, Laser systems engineering

Read Abstract +

A microfabrication system with the use of a femtosecond laser was designed for 3D processing of industrially important materials. The system includes a 120 fs, 1 kHz laser; beam delivery and focusing system, systems for automated 3D target motion and real-time imaging of the sample placed in a vacuum chamber. The first tests of the system on the processing of stainless steel and silicon are presented. We established thresholds and regimes of ablation for both materials. It was found that at relatively low laser fluences I < 3-5 J/cm² the regime of “gentle” ablation takes place, which is characterized by exceptional quality of the ablated surface, but slow ablation rate (< 25 nm/pulse). This regime is especially efficient for the patterning of markers on steel or silicon surfaces. The “fast” ablation regime at I > 10 J/cm² provides much higher ablation rate of 30-100 nm/pulse, giving an opportunity of fast high-quality processing of materials. This regime is well suited for drilling of through holes and fast cutting of materials. However, it was found that fast ablation regime imposes additional requirements on the quality of delivery and focusing of the laser beam because of the presence of parasitic ablation around the main spot on the tail of the radiation intensity distribution. As industrial machining examples, we demonstrate heat-affected-zone free drilling of through holes in a 50 μm thick stainless steel foil and cutting of a 50 μm thick Si wafer with a net cutting speed of 8 μm/sec.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years