CONFERENCE PROCEEDINGS
Advanced Search
Rajmohan Bhandari
at Univ of Utah
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 27 April 2007 Paper
System integration of the Utah electrode array using a biocompatible flip chip under bump metallization scheme
Rajmohan Bhandari, Sandeep Negi, Loren Rieth, Michael Toepper, Sohee Kim, Matthias Klein, Hermann Oppermann, Richard Normann, Florian Solzbacher
Proceedings Volume 6525, 65251K (2007) https://doi.org/10.1117/12.716102
KEYWORDS: Electrodes, Reliability, Metals, Silicon, System integration, Microsystems, Platinum, Gold, Signal processing, Tin
SIGN IN TO:
  • View contact details
UPDATE YOUR PROFILE
Is this your profile? Update it now.
Sign into your SPIE.org account
Don’t have a profile and want one?
Create an account on SPIE.org
Advertisement
Advertisement
Back to Top