Ferroelectric thin films like lead zirconate titanate (PZT) are used to form several different families of MEMS devices. Moving mirrors for optical switching applications utilize the piezoelectric properties of PZT; varactors depend on its dielectric nonlinearity. The oxidizing environment during PZT deposition means that some material capable of resisting oxidation, like platinum, must be used as the metal electrode in any metal-ferroelectric-metal (MFM) stack. Ion milling has been used in laboratory applications for patterning MFM stacks. However, ion milling removal rates are low (~400 Angstroms/min), the throughputs are low, and the etched materials tend to redeposit along the edge of the etch mask, creating veils, or fences, after the etch mask is removed. These residues can lead to yield-limiting defects in finished devices. We report here on MFM stack etch results from a capacitively coupled high density plasma etch reactor. Using photoresist masks, we have demonstrated platinum and PZT etch rates greater than 1000 Angstroms/min at moderate (80 degree(s)C) wafer temperatures. Good etch profiles with no post-etch residue are produced for MFM stacks like those used for a MEMS-based Atomic Force Microscopy application, for example, which employs a bottom platinum layer 1500 Angstroms thick, 2800 Angstroms of PZT, and a platinum top electrode of 1500 Angstroms.
The Advanced Light Source (ALS), which is currently being commissioned at Lawrence Berkeley Laboratory, is a third generation light source designed to produce XUV radiation of unprecedented brightness. To meet the high brightness goal the storage ring has been designed for very small electron beam emittance and the undulators installed in the ALS are built to a high degree of precision. The allowable magnetic field errors are driven by electron beam and radiation requirements. Detailed magnetic measurements and adjustments are performed on each undulator to qualify it for installation in the ALS. The first two ALS undulators, IDA and IDB, have been installed. This paper describes the program of measurements, data analysis, and adjustments carried out for these two devices. Calculations of the radiation spectrum, based upon magnetic measurements, are included. Final field integral distributions are also shown. Good field integral uniformity has been achieved using a novel correction scheme, which is also described.
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