Simulation analysis of heat dissipation of the inner cavity of closed electronic equipment based on Icepak

Shoumin Wang; Qin Wang; Tiantian Gao; Junwei Tian

doi:10.1117/12.3030644

5 June 2024 Simulation analysis of heat dissipation of the inner cavity of closed electronic equipment based on Icepak

Shoumin Wang, Qin Wang, Tiantian Gao, Junwei Tian

Proceedings Volume 13163, Fourth International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2024); 131632S (2024) https://doi.org/10.1117/12.3030644
Event: International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2024), 2024, Xi'an, China

Abstract

According to the actual use requirements of a field temperature measurement equipment, to ensure that the equipment can work stably in the harsh and extreme outdoor environment such as humid heat, high temperature and rain, a design scheme of chassis heat dissipation structure is proposed, and a composite heat dissipation scheme of natural heat dissipation in the inner cavity of the equipment, heat pipe heat conduction of the vapor chamber, and forced air cooling and heat dissipation of the equipment shell. Through the electronic product thermal analysis software Icepak, the initial model of the whole machine and the improved heat dissipation model were simulated and analyzed. The simulation results show that the design of the heat dissipation scheme can improve the thermal conduction efficiency between the heat source in the equipment cavity and the equipment box, effectively reduce the temperature of the high temperature module and the whole chassis body inside the equipment, and control the temperature of the heat source in the cavity of the equipment within the specified working temperature range to meet the conditions of device use.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Shoumin Wang, Qin Wang, Tiantian Gao, and Junwei Tian "Simulation analysis of heat dissipation of the inner cavity of closed electronic equipment based on Icepak", Proc. SPIE 13163, Fourth International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2024), 131632S (5 June 2024); https://doi.org/10.1117/12.3030644

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