Calibration is a crucial step in fringe projection profilometry, which establishes the relationship between unwrapped phase and (FPP) three-dimensional (3-D) shape data (X,Y,h). For an arbitrarily arranged FPP system, a simple geometrical model and mathematical descriptions of the relationships among phase, height distribution, and transverse coordinate are presented. Based on this, a flexible global calibration method is presented to reconstruct 3-D shape by just using a checkerboard with known separation and alternating white and blue. The calibration board is placed at several random positions to determine the relationship between phase and height, and the relationship between pixel position and X, Y coordinates. To get high accuracy, distortion for each pixel is considered. The validity, flexibility, and practicality of this system and calibration technique are verified by experiments.
A one-dimensional Fourier transform of a Rayleigh backscattering traces matrix along the traces direction method has been proposed to simultaneously extract location and frequency information of vibration in the distributed vibration sensing system based on phase-sensitive optical time domain reflectometry. Meanwhile, the signal-to-noise ratio (SNR) of the proposed method also can be improved as the signals are processed in the frequency domain since in the frequency domain, noise is “slow change” compared with the vibration. Then, experiments on two-point vibrations have been done. An SNR of 9.5 dB was achieved, and the spatial resolution is also improved to 3.7 m with a 50 ns pulse width and 2.7 km long fiber owing to the improved SNR.
Fringe projection profilometry (FPP) has been widely used for 3-D surface shape measurement with the features of high accuracy, non-contact and fast speed. In FPP, the phase distribution is extracted from the captured distorted fringe pattern, and the height information could subsequently be obtained by the phase-height relation. In actual measurement, the captured pattern usually contains noises, which will influence the precision of the reconstructed result. In order to increase the accuracy of measurement, noise reduction procedure to these fringe patterns is required. The existing noise reducing methods (such as Fourier transform, Wavelet transform) have certain effect. However, they will eliminate some high frequencies generated by a surface with sharp change and make the image blurring. In this paper, we use Curvelet transform to enhance the accuracy of measurement in FPP. The Curvelet transform has the ability of multiscale and multidirection analysis in image processing. It has better descriptions of edges and detailed information of images. Simulations and the experimental results show that the Curvelet transform has an excellent performance in image denoising and it has a wonderful effect on accuracy enhancement of complex surface shape measurement in FPP.
The demands of the less-defective and high-flatness wafers are urgent in many wafer based technologies ranging from micro-electronics to the current photovoltaic industry. As the wafer becomes thinner and larger to cope with the advances in those industries, there is an increasing possibility of the emerging of crack and warp on the wafer surface. High-accuracy inspection of defects and profile are thus necessary to ensure the reliability of device. Phase measuring deflectometry(PMD) is a fast, cost-effective and high accuracy measurement technology which has been developed in recent years. As a slope measurement technology, PMD possesses a high sensitivity. Very small slope variation will lead to a large variation of the phase. PMD is very possible to have a good performance in the wafer inspection. In this paper, the requirements of the wafer inspection in the industries are discussed, and compatibility of PMD and those requirements is analyzed. In the experimental work, PMD gets the slope information of the wafer surface directly. The curvature or height information can be acquired simply by the derivation or integral of the slope. PMD is proved to make a superior result in high-precision defect detecting and shape measurement of wafer by the analysis of experiment results.
In phase measuring deflectometry (PMD), the fringe pattern deformed according to slope deviation of a specular surface is digitized employing a phase-shift technique. Without height-angle ambiguity, carrier-removal process is adopted to evaluate the variation of surface slope from phase distribution when a quasi-plane is measured. This paper investigates nonlinear carrier components introduced by the generalized imaging process in PMD and the nonlinear carrier removal methods. To remove the nonlinear carrier components in PMD, the reference subtraction technique, series-expansion technique and Zernike polynomials which are normally used in fringe projection profilometry are analyzed on accuracy, processing time and experimental simplicity. What’s more, a new nonlinear carrier removal technique is proposed according to the analytical expression of carrier phase. The theoretical analysis and the experiment results show that the new technique is accurate, simple and time-saving.
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