Mr. Starley Douglas Shelton Profile

Starley Douglas Shelton

SMTS at Canon USA Inc

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Author

Publications (9)

Proceedings Article | 26 August 2024 Paper

Solutions enabling advanced packaging and heterogeneous integration

Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura

Proceedings Volume 13177, 1317706 (2024) https://doi.org/10.1117/12.3032559

KEYWORDS: Advanced packaging, Packaging, Reticles, Distortion, Optical lithography, Semiconductors

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Proceedings Article | 10 April 2024 Presentation + Paper

Study of patterning for advanced packaging

Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura

Proceedings Volume 12953, 129530W (2024) https://doi.org/10.1117/12.3010657

KEYWORDS: Silicon, Distortion, Glasses, Packaging, Optical lithography, Advanced packaging, Lithography

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SPIE Journal Paper | 2 January 2024

Study of submicron-resolution, high-accuracy overlay and large-field lithography for advanced packaging

Ken-ichiro Shinoda, Douglas Shelton, Masaki Mizutani, Ken-Ichiro Mori, Hiromi Suda

JM3, Vol. 23, Issue 01, 011004, (January 2024) https://doi.org/10.1117/12.10.1117/1.JMM.23.1.011004

KEYWORDS: Distortion, Silicon, Overlay metrology, Artificial intelligence, Optical lithography, Light sources and illumination, Critical dimension metrology, Aspheric lenses, Advanced packaging, Submicron lithography

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SPIE Journal Paper | 2 January 2024

Study of fine patterning lithography for panel level packaging

Hiromi Suda, Douglas Shelton, Ken-Ichiro Mori, Ken-Ichiro Shinoda, Yoshio Goto, Kosuke Urushihara

JM3, Vol. 23, Issue 01, 011002, (January 2024) https://doi.org/10.1117/12.10.1117/1.JMM.23.1.011002

KEYWORDS: Packaging, Optical lithography, Overlay metrology, Lithography, Semiconducting wafers, Photoresist materials, Manufacturing, Critical dimension metrology, Coating, Glasses

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Proceedings Article | 22 November 2023 Presentation

Lithography solutions enabling advanced packaging and heterogeneous integration applications

Doug Shelton, Hiromi Suda, Ken-Ichiro Mori, Ken-Ichiro Shinoda, Yoshio Goto, Kosuke Urushihara, Masaki Mizutani, Yusuke Tokuyama

Proceedings Volume PC12751, PC127510C (2023) https://doi.org/10.1117/12.2687747

KEYWORDS: Advanced packaging, Lithography, Semiconducting wafers, Silicon, Reticles, Integrated circuits, Distortion

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Proceedings Article | 26 May 2022 Poster + Paper

Exposure process optimization using machine learning overlay prediction

Masahiro Yoshida, W. H. Wang, C. H. Huang, Elvis Yang, T. H. Yang, K. C. Chen, Yosuke Takarada, Yoshiki Sakamoto, Shin-ichi Egashira, Ken Otani, Tsukasa Saito, Shoshi Katayama, Seiya Miura, Douglas Shelton

Proceedings Volume 12053, 120531L (2022) https://doi.org/10.1117/12.2611020

KEYWORDS: Data modeling, Semiconducting wafers, Overlay metrology, Machine learning, 3D modeling, Lithography, Data acquisition, Wafer testing, Target detection, Process modeling

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Proceedings Article | 5 March 2021 Open Access

Canon U.S.A., Inc.: Canon LI8020SA 250M Pixel CMOS Sensor

Yoshinari Onda, Doug Shelton

Proceedings Volume 11716, 117160C (2021) https://doi.org/10.1117/12.2595953

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Proceedings Article | 22 February 2021 Presentation + Paper

Lithography tool improvement at productivity and performance with data analysis and machine learning

Yosuke Takarada, Douglas Shelton, Tsuneari Fukada, Shosi Katayama, Ken-Ichiro Mori, Seiya Miura

Proceedings Volume 11613, 1161308 (2021) https://doi.org/10.1117/12.2583784

KEYWORDS: Machine learning, Yield improvement, Semiconductors, Imaging systems, Virtual reality, Overlay metrology, Metrology, Intelligence systems, Detector development, Control systems

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Proceedings Article | 22 February 2021 Presentation + Paper

High-resolution patterning for panel level packaging

Ken-Ichiro Mori, Douglas Shelton, Yoshio Goto, Hiromi Suda, Hiroyuki Wada, Hideo Tanaka, Seiya Miura

Proceedings Volume 11613, 116130C (2021) https://doi.org/10.1117/12.2583689

KEYWORDS: Packaging, Optical lithography, Computing systems, Artificial intelligence, Semiconducting wafers, Projection systems, Photoresist materials, Manufacturing equipment, Manufacturing, Image resolution

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Showing 5 of 9 publications

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